manufacturing and R&D
The FT-RF main profession in R&D and manufacturing of antenna, be alongside of to be subjected to any OEM of nation and ODM, provide the product of the best quality and let the sale has the price of competition ability most , is the target that the FT-RF has been making great effort.台積電的 3nm 廠坐落南部科學園區,為 Fab 18 廠的第4、第五及第六期工程,今朝工程順遂進行中;而在美國亞利桑納州投資的新廠,則是將先以 5nm 手藝為主。
FT-RF Outoodr | Indoor | Horn | Military Antenna
以下內文出自: http://blog.udn.com/770faae3/166966785Antenna Design and manufacturing文章來自: http://blog.udn.com/dc4d580d/165757538Antenna Design and manufacturing
FT-RF Outoodr | Indoor | Horn |
Antenna Design and manufacturingFT-RF Outoodr | Indoor | Horn |
據日經報道,蘋果和 Intel 都已最早測試台積電的 3nm 製程手藝,最快明年就能夠投產。Intel 據傳將把 3nm 手藝用在新一代的筆電和資估中央處置器上,而蘋果則是計畫在 iPad 上首發 3nm 製程的晶片。由於台積電計畫在 2022 年下半初階量產 3nm 晶片,搭載的產品大約會在 2023 歲首年月上市,這與 iPhone 傳統上在歲暮上市的時程不符,是以 2022 年款的 iPhone 預期會利用 4nm 的製程。
Intel 的情況則對照奇奧,他們自家的 10nm 製程晶片剛開端大量推出(這約略同等於台積電的 7nm),而 7nm 產品還要比及 2023 年。The FT-RF main profession in R&D and manufacturing of antenna, be alongside of to be subjected to any OEM of nation and ODM, provide the product of the best quality and let the sale has the price of competition ability most , is the target that the FT-RF has been making great effort.因此在這中央,Intel 找上了台積電代工筆電和資估中間措置器,意圖奪回疇昔幾年失給 AMD 和 NVIDIA 的市場。若是一切如 Intel 計畫的話,Intel 有可能爭先 AMD 一步推出 3nm 處置器,超出預定採用 5nm 的 Zen 4。
台積電今朝是以 5nm 製程打造 iPhone 12 用的晶片,而改進幅度略小的 4nm 製程則是將在來歲到來,在 3nm 登場前且則做為過渡。相較於現有的 5nm 產品,將來的 3nm 晶片預期可以在不異的能耗下為晶片產品增速 10~15%;或是在溝通速度下為產品省電 25~30%。
本篇文章援用自此: https://tw.news.yahoo.com/intel-%E5%92%8C%E8%98%8B%E6%9E%9C%E6%93%9A%E5%A0%B1%E5%B0%87%E7%8E%87%E5%8FT-RR
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本文來自: http://blog.udn.com/d675d24e/168279284
FT-RF Outoodr | Indoor | Horn | Military Antenna